|
|
Lead-free solder paste product characteristics
1. Adapt to long-term printing (more than 6 hours).
2. High-intensity antioxidant capacity.
3. It has good viscosity and thixotropy, and it has extremely long viscosity time and is not easy to collapse.
4. Has a very high insulation resistance, no need to clean.
5. It is not easy to produce tiny solder balls after soldering.
V series no-clean lead-free solder paste is a solder paste that is developed according to IPC and JIS and other international standards to meet future environmental protection requirements. It adopts new rosin resin and composite anti-oxidation technology, and selects low-oxidation spherical solder alloy. It is made from powdery and chemically stable paste-like environmentally friendly flux.
Suitable for all kinds of precision welding in the electronic assembly process SMT production. Alloy series no-clean lead-free solder paste
|
|
|
Artificial patch production line
The artificial patch production line is mainly the patch mouth of the artificial simulation placement machine. The air pressure difference (reverse vacuum) generated by the artificial patch pen itself is used to directly suck the patch components from the material belt, and then manually The device is placed in the corresponding PADS position. Through the adjusted air pressure suction, the manual patch pen suction force is less than the sticking force of the solder paste (the patch glue), and the components are automatically placed on the corresponding PADS.
|
|
Manual printing station
1. The combined printing platen has a fixed groove and PIN, which is convenient for installation and adjustment, and is suitable for printing on single and double panels.
2. The school board method uses steel mesh to move, and gives X, Y, Z of the printed (PCB). Correcting fine-tuning is quick and easy.
3. It can set one-way and two-way, multiple printing methods.
4. The blade angle is adjustable, steel scraper and rubber scraper are suitable.
Product parameters:
Printing table area 350×420mm
Frame size 370 × 470mm, 420 × 520mm, 550 × 650mm
Substrate size 250×330mm
Substrate thickness 0.2-2.0mm
Print position fixing PCB Outer Or Pin Positioning
Platen fine-tuning Front/back ±10mm R/L ±10mm
Printing accuracy ±0.05mm
Machine repeatability ±0.02mm
Minimum spacing 0.35mm
Machine size L500×W420×H200mm
Machine weight about 35kgs
|
|
V-FC8810 lead-free reflow soldering
1. Adopt brand LCD computer + PLC intelligent control system, the temperature control accuracy is ±1 °C (if the computer crashes unexpectedly, it can realize offline work without affecting production), and ensure the control system is stable and reliable;
2. Windows2000 operation interface, powerful, easy to operate;
The upper furnace is opened with a double cylinder lifting machine to ensure safety and reliability;
3. Equipped with mesh belt tensioning device, the transportation is stable, no jitter, no deformation, ensuring smooth PCB transportation;
4. Synchronous rail transmission mechanism (can be connected to the automatic placement machine) to ensure accurate and high service life of the guide rail; (optional guide rail)
5. Automatically control the lubrication system, which can automatically lubricate the transmission chain by setting the refueling time and fueling amount;
6. All heating zones are PID controlled by computer (can be separately opened in the temperature division zone. Partition heating can be used to reduce the starting power);
7. The network/chain transmission is fully closed-loop controlled by the computer to meet the simultaneous production of different types of PCBs;
8. With fault sound and light alarm function;
9. With leakage protector to ensure the safety of operators and control systems;
10. Built-in UPS and automatic delay shutdown system to ensure that PCB and reflow soldering machine are not damaged when power is off or overheated;
11. Adopt HELLER world leading hot air circulation heating method, high-efficiency supercharged acceleration air passage, greatly increase circulating hot air flow, rapid temperature rise (about 20 minutes), high thermal compensation efficiency, high temperature welding and curing;
12. The temperature zone has independent temperature sensing sensors to monitor and compensate the temperature balance of each temperature zone in real time;
13. The operating system with password management prevents the unrelated personnel from changing the process parameters. The operation record management can trace the process of changing the process parameters to facilitate the improvement of management. It can store the user's existing temperature and speed settings and the temperature curve under the settings. Print all data and curves;
14. Integrated control window, computer switch, test curve, print curve and transmission data can be easily operated and designed with humanity. Equipped with a three-channel temperature curve online test system, the actual temperature curve of the welded object can be detected at any time (no additional temperature curve tester is required);
The rapid cooling system from international technology adopts magnifying glass centralized high-efficiency quenching, the cooling speed can reach 3.5~6°C/sec, and the management is very convenient. The external forced cooling device ensures the crystallization of solder joints (Option option, standard configuration is Forced natural air cooling);
15. Rosin recovery system: Rosin directional flow, easy to replace and clean. Use special pipeline to transport waste gas, life-long maintenance-free;
16. Special supercharged air transport structure and special-shaped heating wire design, no noise, no vibration, has a very high heat exchange rate, the temperature difference Δt generated between the BGA bottom and the PCB board is extremely small, which is most consistent with the lead-free process. Requirements, especially for lead-free products with high welding requirements.
|
